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Introduction

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Specifications of the device

  • Power: voltage 12-24 VDC +-20%, maximum power 25 W, reverse polarity protection
  • Processor:SoM: Broadcom BCM2837 64-bitVAR-SOM-MX8M-MINI
  • Core: NXP’s i.MX 8M Mini with 1.6 GHz Quad-Corecore ARM CortexCortex-A53 A53and 400 MHz Cortex-M4 real-time processor
  • Timing: 1.26 GHz
  • RAM: 12 GB LPDDR2DDR4
  • Flash eMMC: 8 GB/ 16 GB/ 32 GB
  • 1 x microSD connector
  • 1 x microHDMI 1.3a
  • 1 x microUSB 2.0 HOST / OTG, max. 500 mA
  • 1 x USB-A 2.0 HOST, max. 1 A
  • 1 x modem GSM SIM7600E + microSIM
  • 1 x 1-Wire
  • 7 x DIO -binary digital input/output, max. 30 V
  • 4 x UIO - universal analog-digital input/output (temperature measurement with sensors for ex.: Pt1000, Ni1000, KTY, NTC, current, voltage and resistance)resistance sensors), max. 20 V
  • 5 x DI - binarydigital input (3 x DI), max. 30 V
  • 2 x RS232/RS485RS485, baudrate 50-115200 bps
  • 2 x RS485RS485, baudrate 50-115200 bps
  • 1 x Ethernet 10/100 Mbps - RJ45 connector
  • 1 x WiFi / Bluetooth module (optional)
  • 1 x secure element (optional)
  • 1 x display OLED 0.87" 128x32 px black&white
  • RTC, buzzer, EEPROM
  • Hardware watchdog

Dimensions of the device

The space that the device occupies can be approximated to a cube of the following dimensions: 119 mm x 101 mm x 22.5 mm.

Simplified block diagram

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